Package Assembly

Production and Prototype Monolithic, Hybrid (MCM) and Integrated Microwave (IMA) Assemblies

For the last 20 years, Criteria Labs has provided production and prototype package assembly services to military, space, semiconductor and photonics companies.   Criteria Labs has extensive build to print capabilities to manufacture complex products ranging from  ceramic LTCC & HTCC hermetic assemblies, to high reliability printed circuit boards, single chip and multichip hybrid modules for high frequency RF applications.

Packaging and Electronic Assembly

Criteria Labs offers a full array of IC packaging services from wafer dicing to assembly of GaAs / GaN RF modules and high temperature MCM’s.  In support of our defense customers, we are an ITAR-registered facility, accredited Trusted Supplier and DLA MIL-PRF-38535 certified assembly mfg.  Our new Class 100 clean rooms provide the ultimate in particulate free assembly and ESD protection.

Wafer Dicing Services

Criteria Labs offers high precision dicing of silicon wafers. We also handle cutting materials such as quartz and sapphire. Wafer production services include dicing of up to 8 inch wafers. Our wafer production facility is capable of handling small and large quantities of wafers and substrates.

Package Assembly - Criteria Labs

Die Sorting

  • Wafer die sorting from 4” to 12” wafers to waffle pack, waffle pack to waffle pack, waffle pack to gel pack.

IC Packaging

  • Ceramic Dips, Flat Packs, LCC, CERQUAD, CERPAC, CERAMIC SOIC
  • Side braze, JLCC
  • Multi Chip Module (MCM), Hybrids, Chip on Board (COB)
  • Flex Assembly, Smart Cards, FR4 Chip Bonding
  • Flip Chip
  • Opto Assembly
  • Hermetic Sealing and Encapsulation

RF Assemblies

  • DC to 60 Ghz modules
  • GaAs & GaN assemblies
  • Organic Frame board and LCP substrates
  • Single die to multi chip modules
  • Void free die on shim attach

High Power Void Free Die Attach

  • Power GaAs and GaN amplifiers
  • Silicon Carbide (SiC) die to thermal carrier
  • Solar Cells

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