Solutions

Comprehensive Package Assembly Solutions for High-Reliability Applications

For over twenty years, Criteria Labs has provided production and prototype package assembly solutions for high-reliability and high-temperature applications. Designing RF electronics requires extensive knowledge of components, assembly materials, substrates, and component derating factors. Criteria Labs has extensive build-to-print capabilities to manufacture complex products ranging from ceramic LTCC and HTCC hermetic assemblies, to high-reliability printed circuit boards, and single-chip and Multi-chip hybrid modules for high-frequency.

Package Assembly Capabilities

Packaging and Electronic Assembly

Criteria Labs offers a full array of IC packaging services from wafer dicing to assembly of GaAs / GaN RF modules and high-temperature Multi-chip Modules.  In support of our defense customers, we are an ITAR-registered facility, accredited Trusted Supplier, and DLA MIL-PRF-38535 certified assembly manufacturer. Our Class 100 clean rooms provide the ultimate environment in particulate-free assembly and ESD protection.

Wafer Dicing Services

Criteria Labs offers high precision dicing of silicon wafers. We also handle cutting materials such as quartz and sapphire. Wafer production services include dicing of up to 8-inch wafers. Our wafer production facility is capable of handling small and large quantities of wafers and substrates.

 

Die Sorting

• Wafer die sorting from 4” to 12” wafers to waffle pack, waffle pack to waffle pack, or waffle pack to gel pack.

IC Packaging

• Ceramic Dips, Flat Packs, LCC, CERQUAD, CERPAC and CERAMIC SOIC
• BGA, CQFP, CPGA, TO-CAN and METAL CAN
• Side braze and JLCC
• Multi-chip module (MCM), Hybrids and Chip on Board (COB)
• Flex Assembly, Smart Cards, and FR4 Chip Bonding
• Flip Chip
• Opto Assembly
• Hermetic Sealing and Encapsulation

RF Assemblies

• DC to 60 Ghz modules
• GaAs and GaN assemblies
• Organic Frame board and LCP substrates
• Single die to Multi-chip modules
• Void free die on shim attach

High Power Void Free Die Attach

• Power GaAs and GaN amplifiers
• Silicon Carbide (SiC) die to thermal carrier
• Solar Cells