Device Qualification

Need A Quick Turn Device Qualification To Meet Aggressive Schedules?

Criteria Labs has extensive device qualification capabilities. Criteria Labs provides unique qualification solutions to address a broad range of customer requirements such as; providing over flow test chambers when internal resources are tied up and busy; some of our customers have limited internal test capabilities and need to leverage an external partner; there could be a need for assistance in developing a device qualification process; many times our customers have a unique, hard to test requirement.  What is common to all these requirements is the need for quick turn device qualification to meet aggressive production release schedules.


  • ISO 9001:2015
  • DLA MIL-PRF-38535
  • DLA MIL-STD-883
  • ISO 17025
  • AEC-100/200 Compliant
  • TELCORDIA Compliant
  • ITAR
  • DMEA Trusted

Criteria Labs provides stress based reliability qualification services to semiconductor manufacturers, military, aerospace and OEM’s. Criteria Labs experienced Reliability Engineers can create qualification plans and perform testing to meet your requirements with strict adherence to applicable MIL-STD-883, MIL-STD-750, MIL-STD-202, JEDEC, AEC-Q100/Q200 and TELCORDIA specifications.

Device Qualification - Criteria Labs



  • Pre-Conditioning
  • MSL Sensitivity Testing
  • Temperature Cycle
  • Thermal shock/Liquid to Liquid
  • THB
  • HAST
  • HTS
  • Autoclave
  • Salt Atmosphere
  • Lead Integrity
  • Hermeticity – Fine/Gross Leak
  • CSAM
  • Centrifuge/Constant Acceleration
  • Wire Bond Shear Test
  • Wire Bond Pull Test
  • Die Shear Test
  • Ball Grid Array (BGA) Ball Shear
  • Mark Permanency
  • Solderability
  • Physical Dimension
  • RTS
  • Mechanical Shock
  • Mechanical Vibration
  • Moisture resistance
  • MSL Characterization
  • Reflow Characterization
  • Bake & Dry Pack
  • Burn in Board Design
  • Electrical Testing at temp -65c thru 250c
  • Lead torque
  • Pin D
  • Bond Shear
  • Group Testing
  • Endurance Test
  • Device Characterization
  • IPC 9701 and GR-468 second level package stress testing


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