solutions-banner-img

RF GaAs / GaN Eutectic Void Free Die to Shim Attach

Criteria Labs has been providing void free die attach services since 2009 for demanding high power RF applications.   High thermal CTE matched substrates include Copper Molybdenum (CuMo), tungsten and ultra high thermal conductivity diamond.

Learn how we can help you

Accelerate time to market Solve Tough Problems  Provide Unique Capabilities

Request Information