Die Processing

Criteria Labs offers custom wafer sawing up to eight inches. Wafers are mounted on tape and frame then packed in gel or waffle packs oriented and packaged to your specifications.
Criteria Labs will visually inspect die to commercial or military standards. Transistors and diodes are typically inspected to MIL-STD 750 methods 2072 & 2073; integrated circuits are inspected to MIL STD-883, method 2010A (space-level) or 2010B. We are happy to accommodate customer requests for die inspection needs beyond or outside these specifications. Our internal processes preserves wafer lot traceability.
Combining Criteria Labs wide array of electrical and environmental test capabilities into our sampling qualification, ensures successful and reliable lot qualifications for our customers. We offer complete element evaluation and lot qualification compliant with QML -38535 and MIL-PRF-5004, or to customer specifications. Our ISO 9002 audited facility and MIL-compliant testing capabilities give our die customers one-stop shopping for their die qualification needs.
- Wafer Saw (2" to 8")
- Wafer Sort
- Visual inspection (MIL-STD 883 Method 2010 A or B)
- Die Mapping
- Wafer wash / ink removal
- Die Sort Duals, Trios & Quads
- Die to Waffle Pack
- Die to Tape
- Bar Code Labels
- Special Packing