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  LTX Diamond D10

  Software Development

  Wafer Probe

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• Device Characterization
• Device Upscreening
• Package Assembly
  Dicing

  Die Sorting

  IC Packaging

  Hi Power Void Free Die Attach

• Qualification
  Preconditioning

  CSAM

  HAST

  Burn In

• Tape and Reel
  Tray to tape

  Tube to tape

  Bulk to tape

  Passives and Components

• Failure Analysis
  DPA CSAM Counterfeit Analysis RTS
• Destructive Physical Analysis
• Counterfeit Analysis
• ESD Testing
  HBM

  Latch up

  MM

  CDM

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