Wafer Test, Final Test and Test Engineering Services
Test platforms encompass wafer probe and finished package testing. Mixed Signal, Analog, Digital and Memory.

Die Processing
Saw wafers up to eight (8) inches, inspected then packed in gel or waffle packs.

Plastic Device Qualification Testing
IC Qualification and Reliability Evaluation of plastic packaged semiconductor devices. Burn-In, HTOL, HAST, etc.

Ceramic Assembly Qualification and Test Screening
High reliability qualification and reliability evaluation for defense and military. MIL-38535/883 Groups A, B, C and D.

ESD and Latch Up
Tests devices to any commercial or military ESD standard and for Latch-Up.

Destructive Physical Analysis (DPA)
Process of disassembling, testing, and inspecting a high reliability component to ensure fabrication standards.

Reliability Analysis or Failure Analysis
Evaluate your integrated circuit that may have failed, locate and help identify the problem.

Focused Ion Beam (FIB) Circuit Modifications
Make IC circuit modifications and perform precision cross sections with sub micron accuracy.

Electronic Device Physical Evaluation and Analysis
Verify that components are fabricated to the required standards and mechanical dimensions are within original specifications.

Hot Solder Dip
Reduce the risk of tin whisker induced failures by hot solder dipping the component's plated leads.

Counterfeit Parts Evaluation
Investigate suspected counterfeit parts by performing XRAY, de-capsulation and then die inspection.

Lead-Free Plastic Package Temperature Profiling NEW!
Repeatable profiling at high temp ramp rates for lead free, Green Mold devices, subjected to new high temp reflow profiles.

Packaging and Electronic Assembly
Assembly solutions including ceramic dips, flat packs, metal cans, MCM, COB, and opto assemblies. MIL-PRF-38535 certified.

Tape and Reel
From SOT's to large BGA's, from tube or tray, we will tape your product to your exact specifications.

Ball or Lead Inspection and Conditioning
Laser and optical inspection equipment for lead or ball devices. Inspect for co-planarity, bent-leads, pitch etc.

Bake and Dry Pack
Bake your parts and then dry pack them with humidity indicator cards and desiccant.

Obsolescence and Component Sourcing
Hard to find die or packaged IC procurement services or test existing components and upgrading them to higher reliability specifications.

Up Screening and Test
Test existing components for the purpose of upgrading them to higher reliability specifications.