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TURN KEY RF SPACE QUALIFIED DEVICES

Custom Tailored To Meet Your Exact Specifications

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PEM’s RF PARTS UPSCREENING TO NASA EEE-INST-002 (L1 & L2)

When Space Qualified Hermetic Parts Are Not Available

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RF GaAs / GaN DIE ON SHIM (VOID FREE DIE ATTACH)

For Critical High Thermal Transfer Applications

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Design Services

Access Professional Design Talent To Solve Your Project Problems

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Package Assembly

Production and Prototype Monolithic, Hybrid (MCM) and Integrated Microwave (IMA) Assemblies

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HIGH TEMPERATURE PACKAGE ASSEMBLY (to 250°C)

Experts In High Temperature Design And Assembly

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TEST (RF, GaAs, GaN, Silicon and Photonics) WAFER PROBE AND PACKAGE DEVICES

RF, GaAs, GaN, Silicon and Photonics Testing

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Device Qualification

Need Quick Turn Device Qualification To Meet Aggressive Schedules?

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250°C HIGH TEMPERATURE DEVICE CHARACTERIZATION AND QUALIFICATION

No Other Outside Lab Has Criteria Labs High Temperature Capabilities

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Tape and Reel

Largest Service Provider In The USA

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