Product companies that need semiconductor devices to operate outside the published temperature or performance range, rely on Criteria Labs to provide Device Characterization testing and analysis. Criteria Labs can perform device characterization and aging over extreme temperature ranges from -75*C to +275*C to meet your mission profile. For plastic packaged devices, Criteria Labs can extract die and repackage into ceramic or kovar packages or take customer die and package into high temp carriers for testing. Once Device Characterization is complete, Criteria Labs is your one stop shop to assist in the development of a new package and provide production package assembly and test.
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Services
- Test
LTX Diamond D10
Software Development
Wafer Probe
Production test
- Device Characterization
- Device Upscreening
- Package Assembly
Dicing
Die Sorting
IC Packaging
Hi Power Void Free Die Attach
- Qualification
Preconditioning
CSAM
HAST
Burn In
- Tape and Reel
Tray to tape
Tube to tape
Bulk to tape
Passives and Components
- Failure AnalysisDPA CSAM Counterfeit Analysis RTS
- Destructive Physical Analysis
- Counterfeit Analysis
- ESD Testing
HBM
Latch up
MM
CDM
- Test
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