Services

Test

  • LTX Diamond D10
  • Software Development
  • Wafer Probe
  • Production test

Device Characterization
Device Upscreening
Package Assembly

  • Dicing
  • Die Sorting
  • IC Packaging
  • Hi Power Void Free Die Attach

Qualification

  • Preconditioning
  • CSAM
  • HAST
  • Burn In

Tape & Reel
Failure Analysis
DPA
Counterfeit Analysis