Reliability and Qualification Engineering

Criteria Labs specializes in services aimed at assessing the long term reliability of ICs and their suitability of use. Reliability services characterize and evaluate IC design, wafer processing, foundry sources, and assembly processing. Our capabilities include the evaluation of packaging technologies such as QFP, BGA, PLCC and other High Density Interconnect packages.
Our reliability and device qualification process will ensure IC packages are properly designed and assembled to both JEDEC and MIL standards by performing environmental and mechanical stress tests, which accelerate the occurrence of failure mechanisms. Let Criteria Labs be your total one stop solution for all your reliability and qualification engineering needs.
- Design device qualification programs
- Burn-in / HAST board design
- Quick turn around
- One stop shop
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