Reliability Analysis and Failure Analysis
Criteria Labs has extensive microelectronic Failure Analysis process capabilities. Our engineers and analysts can evaluate your integrated circuits that may have failed during design, manufacture, qualification or service to locate and help identify the problem.
Identifying the problem or failure may require up to three (3) levels of effort and are defined as Level I, II or III.
Level I Analysis
The majority of microelectronic devices can be detected during the "Level I" analysis. The initial inspection employs the following techniques to verify packaging integrity and microscopically inspect for damage.
- External Device Inspection
- I/V Characterization (curve trace)
- X-ray Inspection
- Acoustic Microscopy (CSAM)
- Chemical or Mechanical De-capsulation
- Optical Microscopic Examination
- Report Documentation
Level II Analysis
Level II analysis is performed upon completion of the Level I analysis when no defect was found after de-capsulation and optical or microscopic inspection. Light emission microscopy (LEM) and Liquid Crystal processes are then used to detect and locate defects.
Level III Analysis
Level III analysis is preformed upon completion of the Level II analysis and involves chemical de-layering and/or precision cross-sectioning of an IC indication site. The object is to view the indication relative to its location within the IC. Both optical and SEM inspection are employed to document the failing sites. Results of the analysis are documented with the Level I and Level II results.
Capabilities
- Acoustic Microscopy (CSAM)
- Focus Ion Beam (FIB)
- Scanning Electron Microscope (SEM)
- X-Ray
- Real Time X-Ray
- Cross Sectioning
- Micro-Probe
- Light Emission Microscopy
- De-Cap (Wet) manual/acid jet etcher
- Construction Analysis
- Parallel Polishing
- Front Lapping
- Latch Up / Electrical Overload Stress (EOS)
- Electro Static Discharge (ESD)
- EDX
- Digital image capture
- Solderability Testing