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Process Engineering for Microelectronic Packaging

Criteria Labs was established to provide backend Semiconductor Manufacturing Services for the defense, aerospace, medical (including life support), military, communications, automotive and computer markets. Criteria Labs is equipped to assemble and test devices used in satellites, space probes, military and commercial aircraft, ground and naval systems and implanted medical applications. In addition to assembly, test, destructive physical analysis (DPA) and device qualifications, Criteria Labs also provides complete electronic package assembly for HYBRIDS, Chip On Board, ceramic packages and smart cards. Criteria Labs provides a complete solution of semiconductor backend manufacturing services to our customers, including front-end engineering testing, wafer probing, final testing of logic and mixed signal semiconductors and tape and reel services. Our testing services employ technology and expertise that are among the most advanced in the semiconductor industry.

Criteria Labs has extensive experience in process development and tooling design to lower assembly costs and improve yields. We will support engineering prototypes and low to higher volume assembly of complex single or multi chip devices.

Criteria Labs has experience with a wide variety of die attach materials, profiling to meet specific die attach requirements, with complete assembly testing and lab suitability qualification services.

Whether your package has only a single die or a complex MCM, our engineers can take your packaging concept and turn it into reality.

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