Plastic Device Qualification Testing
Criteria Labs is your complete turnkey outsource partner for IC Qualification and Reliability Evaluation of plastic packaged semiconductor devices. Criteria Labs has the in house equipment and engineering staff to perform all JEDEC and MIL-STD-883 Standard Test Methods for environmental, mechanical and process testing. Having such extensive capabilities allows Criteria Labs to design all required test hardware such as burn-in boards and perform these tests on site, significantly reducing your cycle times and logistics support.
Qualification Capabilities
- Environmental Qualification Tests
- Pre-Conditioning of Plastic Surface Mount Devices Prior to Reliability Testing (IPC/JEDEC J-STD-020)
- Moisture Sensitivity Test for Plastic Surface Mount Devices (IPC/JEDEC J-STD-020)
- Tin-Lead (SnPb) and Lead free (Pb-Free) re-flow profile to JEDEC or Japanese Automotive requirements (IPC/JEDEC J-STD-020)
- Steady State Temperature Humidity Bias Life Test (85/85) (EIA/JESD22-A101)
- Accelerated Moisture Resistance-Unbiased Autoclave (JESD22-A102)
- High Temperature Storage Life (JESD22-A103)
- Temperature Cycling ((JESD22-A104)
- Thermal Shock (JESD22-A106)
- High Temperature Operating Life (JESD22-A108)
- Highly-Accelerated Temperature and Humidity Stress Test (HAST) (JESD22-A110)
- Accelerated Moisture Resistance-Unbiased HAST (JESD22-A118)
Mechanical Qualification Tests
- Electro Static Discharge Charge Device Model (EIA/JESD22-101)
- Electro Static Discharge Human Body Model (EIA/JESD-A114)
- Electro Static Discharge Machine Model (EIA/JESD-A115)
- Physical Dimensions (JESD22-B100)
- Solderability (JESD22-B102)
- Lead Integrity (JESD22-B105)
- Static Latch-Up Measurements (EIA/JESD78)
- Bond Pull Strength (Method 2011)
- Solvent Resistance (Method 2015)
- Die Shear (Method 2019)
Process Testing
- Adhesion of Lead Finish (Method 2025)