Packaging and Electronic Assembly

Criteria Las has consistently provided aerospace, defense/military, medical, industrial and commercial industries with assembled devices that meet their most stringent requirements. Criteria Labs electronic package assembly area can provide a wide array of assembly solutions including ceramic dips, Flat packs, metal cans, sidebraze, JLCC, Multi Chip Modules (MCM), Hybrids, Chip on Board (COB), flex assembly, FR4 chip bonding, MIMS and Opto Assemblies.

Our operations are fully compliant with Mil-STD-883 Methods 5004 and 5005 with certified Test Lab Facilities. Criteria Labs is on the Qualified Manufacturer List for 2nd party QML Assembly per MIL-PRF-38535. We are certified as a Mil-STD-883 testing facility by DOD, ITAR registered (International Traffic in Arms Regulation) along with ISO 9001:2000 certification.

Criteria Labs diverse assembly capabilities provide opportunities for small lot manufacturing as well as large lot, continuous production. The process control and process monitoring within the Criteria Labs assembly line exceed the requirements for Space level manufacturing.

All assembly operations are in our class 10,000 certified clean room. Critical assembly operations are performed within isolated class 100 laminar flow stations. Both gold eutectic and silver glass die attach are utilized, including gold braze in the SST High Vacuum system. Wire bonding can be either gold or aluminum. In-process monitors (die shear or stud pull and bond pull) ensure that the die attach and wire bond processes remain within control limits. Our SST High Vacuum chamber can support glass frit and solder seal in a highly repeatable, temperature, atmosphere and vacuum controlled process. Most hermetic package types are supported for all of the major technologies (Digital, Analog, Mixed Signal, ASIC, etc).

Commercial, Military, Medical Custom, Ceramic & Prototype (Class B & Class S)

• Ceramic Dips, Flat Packs, LCC, CERQUAD, CERPAC, CERAMIC SOIC
• BGA, CQFP, CPGA, TO-CAN, METAL CAN
• Sidebraze, JLCC
• Multi Chip Module (MCM), Hybrids, Chip on Board (COB)
• Flex Assembly, Smart Cards, FR4 Chip Bonding
• MIMS Assembly
• Opto Assembly
• Die Attach Material
  • Silver Glass: QMI 2569 Conductive
  • Silver Filled Cyanate Ester: JM-7000 & QMI-84-1 or 3 (Conductive or Non Conductive)
  • Silver filled epoxy
  • Electrically insulating epoxy
  • Low temp cure epoxies
  • Eutectic:
    • 2% silicon 98% Gold perform
  • 80% Gold 20% Tin Preform
• Sealing and Encapsulation
  • Solder Sealing (Gold-Tin Eutectic) and Glass Sealing (moisture < 5000 ppm)
  • Resistance Welding for Metal Cans
  • Glob Topping with Hysol material on custom packages
  • Seam Seal
  • Taped lids
  • B-Stage epoxy attachment
• Assembly Testing (Quality Conforms or exceeds Military requirements)
  • Die Shear Strength
  • Bond Pull
  • Non-Destructive Bond Pull (Class S)
  • Fine and Gross Leak testing
  • Constant Acceleration (Centrifuge)
  • Particle Impact Noise Detection (PIND)
  • Solderability
  • Temperature Cycle
  • Resistance to Solvents
  • External Visual
• Lab Suitability Qualification Services
  • Solder Dip
  • Lead Trim & Form / Manual
  • Lead Inspection and repair
  • Temperature Cycle
  • Constant Acceleration (Centrifuge)
  • Particle Impact Noise Detection (PIND)
  • Fine and Gross Leak
  • Resistance to solvents testing
  • Marking
  • Demark & Remark
  • Ball Shear