function mmLoadMenus() {
  if (window.market_solutions_0) return;
   window.market_solutions_0 = new Menu("root",185,20,"Verdana, Arial, Helvetica, sans-serif",10,"#2F1C6D","#D8352B","#FFFFFF","#FFFFFF","left","middle",3,0,1000,-5,7,true,true,true,0,false,false);
    market_solutions_0.addMenuItem("Fabless / JEDEC","location='solutions1.htm'");
    market_solutions_0.addMenuItem("Defense / Military / Space","location='solutions2.htm'");
    market_solutions_0.addMenuItem("Package Assembly / Medical","location='solutions3.htm'");
    market_solutions_0.addMenuItem("Contract Mfg / Distributors","location='solutions4.htm'");
    market_solutions_0.hideOnMouseOut=true;
    market_solutions_0.bgColor='#FFFFFF';
    market_solutions_0.menuBorder=1;
    market_solutions_0.menuLiteBgColor='#FFFFFF';
    market_solutions_0.menuBorderBgColor='#999999';
  window.engineering_0 = new Menu("root",185,20,"Verdana, Arial, Helvetica, sans-serif",10,"#2F1C6D","#D8352B","#FFFFFF","#FFFFFF","left","middle",3,0,1000,-5,7,true,true,true,0,false,false);
	engineering_0.addMenuItem("Semiconductor Test Solutions","location='engineering1.htm'");
    engineering_0.addMenuItem("Reliability Engineering","location='engineering2.htm'");
    engineering_0.addMenuItem("Process Engineering","location='engineering3.htm'");
    engineering_0.hideOnMouseOut=true;
    engineering_0.bgColor='#FFFFFF';
    engineering_0.menuBorder=1;
    engineering_0.menuLiteBgColor='#FFFFFF';
    engineering_0.menuBorderBgColor='#999999';
   window.services_0 = new Menu("root",215,20,"Verdana, Arial, Helvetica, sans-serif",10,"#2F1C6D","#D8352B","#FFFFFF","#FFFFFF","left","middle",3,0,1000,-5,7,true,true,true,0,false,false);
    services_0.addMenuItem("Wafer & Package Test","location='service1.htm'");
    services_0.addMenuItem("Die Processing","location='service2.htm'");
    services_0.addMenuItem("Plastic Device Qualification","location='service3.htm'");
    services_0.addMenuItem("Ceramic Device Qualification","location='service4.htm'");
    services_0.addMenuItem("ESD & Latch Up","location='service5.htm'");
    services_0.addMenuItem("Destructive Physical Analysis (DPA)","location='service6.htm'");
    services_0.addMenuItem("Reliability Analysis / Failure Analysis","location='service7.htm'");
    services_0.addMenuItem("FIB (Focused Ion Beam) Ckt Mods","location='service8.htm'");
    services_0.addMenuItem("Electronic Device Physical Evaluation","location='service9.htm'");
    services_0.addMenuItem("Hot Solder Dip","location='service10.htm'");
    services_0.addMenuItem("Counterfeit Parts Evaluation ","location='service11.htm'");
    services_0.addMenuItem("Lead-Free Plastic Pkg Temp Profiling","location='service12.htm'");
    services_0.addMenuItem("Packaging and Electronic Assembly","location='service13.htm'");
    services_0.addMenuItem("Tape and Reel","location='service14.htm'");
    services_0.addMenuItem("Ball or Lead Inspection","location='service15.htm'");
    services_0.addMenuItem("Bake & Dry Pack","location='service16.htm'");
    services_0.addMenuItem("Obsolescence / Component Sourcing","location='service17.htm'");
    services_0.addMenuItem("Up Screening and Test","location='service18.htm'");

   services_0.hideOnMouseOut=true;
   services_0.bgColor='#FFFFFF';
   services_0.menuBorder=1;
   services_0.menuLiteBgColor='#FFFFFF';
   services_0.menuBorderBgColor='#999999';

services_0.writeMenus();
} // mmLoadMenus()

function MM_swapImgRestore() { //v3.0
  var i,x,a=document.MM_sr; for(i=0;a&&i<a.length&&(x=a[i])&&x.oSrc;i++) x.src=x.oSrc;
}

function MM_preloadImages() { //v3.0
  var d=document; if(d.images){ if(!d.MM_p) d.MM_p=new Array();
    var i,j=d.MM_p.length,a=MM_preloadImages.arguments; for(i=0; i<a.length; i++)
    if (a[i].indexOf("#")!=0){ d.MM_p[j]=new Image; d.MM_p[j++].src=a[i];}}
}

function MM_findObj(n, d) { //v4.01
  var p,i,x;  if(!d) d=document; if((p=n.indexOf("?"))>0&&parent.frames.length) {
    d=parent.frames[n.substring(p+1)].document; n=n.substring(0,p);}
  if(!(x=d[n])&&d.all) x=d.all[n]; for (i=0;!x&&i<d.forms.length;i++) x=d.forms[i][n];
  for(i=0;!x&&d.layers&&i<d.layers.length;i++) x=MM_findObj(n,d.layers[i].document);
  if(!x && d.getElementById) x=d.getElementById(n); return x;
}

function MM_swapImage() { //v3.0
  var i,j=0,x,a=MM_swapImage.arguments; document.MM_sr=new Array; for(i=0;i<(a.length-2);i+=3)
   if ((x=MM_findObj(a[i]))!=null){document.MM_sr[j++]=x; if(!x.oSrc) x.oSrc=x.src; x.src=a[i+2];}
}