Focused Ion Beam FIB Circuit Modifications

Focused Ion Beam (FIB) Circuit Modifications

Criteria Labs was established to provide Semiconductor Manufacturing Services for the defense, aerospace, medical (including life support), military, communications, automotive and computer markets. Criteria Labs is equipped to assemble and test devices used in satellites, space probes, military and commercial aircraft, ground and naval systems and implanted medical applications. In addition to assembly, test, destructive physical analysis (DPA) and device qualifications, Criteria Labs also provides complete electronic package assembly for HYBRIDS, Chip On Board, ceramic packages and smart cards. Criteria Labs provides a complete solution of semiconductor backend manufacturing services to our customers, including front-end engineering testing, wafer probing, final testing of logic and mixed signal semiconductors. Our testing services employ technology and expertise that are among the most advanced in the semiconductor industry.

Criteria Labs has an in house FIB for making circuit modifications, create probe and wire bond pads and perform precision cross sections with sub micron accuracy.

Circuit Modifications

Make cut and jump edits on microelectronic devices. This provides for a very cost effective method to debug and make design changes prior to re-masking.

Probe Pads

Deposit probe points that allow for electrical characterization that are not accessible via conventional probing techniques.

Wire Bond Pads

Deposit wire bonding pads for high current modifications.

Precision Cross Sections

Perform precision cross sections with sub micron accuracy. Cross section photo resist, MEMS, and biological structures that do not lend themselves to conventional mechanical cross section techniques.