Physical Analysis
Electronic Device Physical Evaluation and Analysis
Criteria Labs can perform both JEDEC and MIL-STD-883 physical analysis of microelectronic devices. This process is used by our customers to verify and guarantee that components or devices are fabricated to the required standards and to confirm mechanical dimensions and physical features are within original specifications.
Circuit Modifications
Make cut and jump edits on microelectronic devices. This provides for a very cost effective method to debug and make design changes prior to re-masking.
NEW!! Counterfeit Product Analysis Service
Electronic devices are purchased from a variety of sources. Unless you purchase your parts directly from the FAB, there is a chance that your purchased parts may be counterfeit. Let Criteria Labs investigates suspect parts by performing XRAY, de-capsulation and then examine die for manufactures markings. This is a cost effective way to identify a problem before it becomes a problem.
NEW!! High Accuracy Temperature Profiling Oven
Criteria Labs has developed its own proprietary temperature profiling oven. Our new profiling oven was designed to give customers repeatable profiling temperatures and high controlled temperature ramp rates from 1 to 9 degrees *C per second. If you need to profile plastic lead free parts or changing over to Green Mold Compound, let Criteria Labs verify that your plastic parts can withstand these new high temp reflow profiles.
- Counterfeit parts evaluation
- Acoustic Microscopy (CSAM)
- Lead free re-flow charting and validation to JEDEC-22 or Japanese Automotive requirements (Green mold compound)
- BGA & uBGA automatic ball inspection
- Bond Pull
- Die Shear
- Solder Dip
- Lead Trim
- Lead Inspection and Repair
- Solderability Restoration
- Bake and dry pack
Destructive Physical Analysis (DPA)
Criteria Labs has complete Destructive Physical Analysis (DPA) process capabilities. DPA is the process of disassembling, testing, and inspecting a component for the purpose of determining conformance with applicable design and process requirements. This process of sample testing is used to ensure that high reliability components or devices are fabricated to the required standards.
In addition to routine DPA, Criteria Labs performs constructional analysis on COTS components on a regular basis for our customers qualifying non-QPL or non-QML product. The requirements for these analyses are tailored and customized individually to address our customer's needs and concerns.
- External Visual (Method 2009)
- Internal Visual Inspection (Method 2010, condition B)
- Internal and External Photographs
- Radiographic Inspection (Method 2012)
- Hermetic Seal Testing (Method 1014)
- Bond Pull Testing (Method 2011)
- Scanning Electron Microscopy (SEM) (Method 2018)
- Energy Dispersive X-Ray (EDX)
- Die Shear Testing (Method 2019)
- Photograph of the internal construction and pad locations
- Summary report


