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RF IMA Design Engineer: Design and Integration of complex RF Integrated Microwave Assembly (IMA’s) and RF Multi Chip Modules (MCM’s) for phase array and communication systems for Military and Space systems.
RF Test Engineer: Design RF test fixtures, selection of RF test sockets and develop PNAX test solutions for IMA’s, MCM’s and monolithic electronic devices.
Production Supervisor: Manage production schedules, staff and training programs.
Automated Tool Operator: Operate and program automated package assembly tools in a clean room environment. Tools include DATACON die attach tools, HESSE and K&S wire bonders (ribbon, wedge and ball bonders), Horizon Screen printer tool, Juki pick and place tools just to name a few.
Test Operator: Test RF, digital and analog semiconductor product on RF PNAX test systems, National Instruments Lab View PXI test systems and Diamond final package test and wafer prober systems.
Packaging Assembly Operator: Manual die attach, product visual inspection and assist in the production of complex integrated circuits.
Package Assembly Process Engineer: Develop processes for new product introductions and support process improvement efforts. Must understand material interactions, solder processes and package assembly methodes.
Package Assembly Wire Bond Tech: Setup and development of wire bond programs for new designs and support production product applications. Experience with MCM and other complex module wire bonding.
Purchasing and Inventory Control: Hands on position purchasing components, tooling and other product to meet production schedules and manage inventory. Position also includes kitting material to support production orders.
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