Bake and Dry Pack
Moisture control has always been an extremely important issue with Surface Mount Devices and with the migration towards Lead Free parts, the issues are even more pronounced. Criteria Labs can bake your parts and then dry pack them with humidity indicator cards and desiccant.
Criteria Labs bakes all parts according to your required MSL (moisture sensitivity level) as defined by IPC and JEDEC Standards. Moisture sensitivity for semiconductor devices are classified based on end product re-flow sensitivity. Parts are classified into eight categories numbered as: MSL-1, MSL-2, 2a, 3, 4, 5, 5a, and 6, with 6 being the most sensitive to moisture.
Criteria Labs checks each incoming lot of semiconductors upon receipt for its moisture sensitivity level number and its package thickness to select and specify baking process times. The parts are then baked in calibrated ovens for the specified time and dry-packed immediately upon removal in order to minimize any exposure to moisture.
Capabilities
- Large capacity, microprocessor controlled ovens
- Meets and exceeds EIA 583 standards.
- Aluminum tube tooling available to minimize handling.
- Protective packaging - Using high quality ESD aluminum moisture barrier bags
- Tyvek clay desiccant
- Humidity Indicator cards for quality environmental packaging
- High volume dry pack bag sealers - offering air tight clean seals
- Vacuum and soft seal capability
- Bake and exposure times clearly recorded for quality purposes
- Customized exposure warning labels
- All packages supported - Tubes, Trays, Die, Waffle packs and wafers
Delivery
- Normal turn around time is 3 working days. When needed, we provide same day, next day and two day service
- Daily pick-up and delivery, all major carriers
- Criteria Labs can also handle drop shipments to domestic or international locations