Advanced Packaging Assembly Services
Criteria Labs provides world-class advanced packaging assembly services to meet all your design requirements. We can take you from prototype design to high-volume production. Whether you have a simple monolithic process, high-technology mix, chip on board with surface mount technology or complex multi-chip or opto assemblies, Criteria Labs can meet all your assembly specifications.
Engineering
Criteria Labs has assembled world-class design and engineering teams to solve your complex problems.
Turnkey- Product engineering
- Process development for advanced technology
- Construction analysis
- Semiconductor failure analysis
- Characterization and validation of new silicon (digital, mixed signal, discrete components, i.e. transistors, diodes and RF)
- Test plan and design for testability, probe and final test (digital, mixed signal, discrete components, i.e. transistors, diodes and RF)
- Load board design (low frequency to high frequency)
- Burn-in/HAST board design
- DUT/probe interface boards
- Tape pocket design (for tape & reel services)
- Hybrids
- Chip on board designs (COB)
- Advanced packaging
- Flex boards
- Smart cards
Specialty Services
Criteria Labs provides a broad array of inhouse services to reduce your time to market, verify quality and make sure what's being shipped meets your exact specifications.
- Wafer Test, Final Test and Test Engineering Services
- Die Processing
- Packaging
- Product Assembly Qualification
- Electronic Device Physical Evaluation and Analysis
- Reliability Analysis or Failure Analysis
- Tape and Reel Services
- Quality Systems
- Certifications and Compliance Processes
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